TO-5

Standardized metal semiconductor package
Transistor in a TO-5 package with 25 mm leads.
Gear-shaped heat sinks for TO-5 packages.

In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC.[1] The first commercial silicon transistors, the 2N696 and 2N697 from Fairchild Semiconductor, came in a TO-5 package.[2]

Construction and orientation

The tab is located 45° from pin 1, which is typically the emitter. The typical TO-5 package has a base diameter of 8.9 mm (0.35 in), a cap diameter of 8.1 mm (0.32 in), a cap height of 6.3 mm (0.25 in).[1] The pins are isolated from the package by individual glass-metal seals, or by a single resin potting. Sometimes one pin is connected directly to the metal case.

Variants

Several variants of the original TO-5 package have the same cap dimensions but differ in the number and length of the leads (wires). Somewhat incorrectly, TO-5 and TO-39 are often used in manufacturer's literature as synonyms for any package with the cap dimensions of TO-5, regardless of the number of leads, or even for any package with the diameter of TO-5, regardless of the cap height and the number of leads.[3] Compared to TO-5, for the other variants (except TO-33 and TO-42) the minimum length of the leads was shortened from 38.1 mm (1.50 in) to 12.7 mm (0.50 in) which is sufficient for through-hole technology and leads to a cost reduction, whereas the longer leads were needed for point-to-point construction. Lead lengths of 25.4 mm (1.00 in) and 19.05 mm (0.750 in) are quite common but were not standardized separately by JEDEC. There are variants with between 2 and 12 leads. The leads are arranged in a circle with a diameter of 5.08 mm (0.200 in) (except TO-96, TO-97, TO-100, TO-101). Before the introduction of dual in-line packages in 1965, integrated circuits were packaged mostly in metal can packages such as the TO-5 variants with more than 3 leads.[4]

TO-39 / TO-9 / TO-16 / TO-42

The TO-39, TO-9, and TO-16 packages have 3 leads and differ in the shortened leads mentioned above from TO-5.[5] Additionally, the TO-9 and TO-16 packages do not have a tab.[6] The TO-42 package is almost identical to the TO-5 package (including the long leads) but has four stand-offs at the bottom of the base that keep the base about 0.5 mm above the circuit board.[7] Possibly the TO-16 and TO-42 designations were not actually used.[2]

TO-12 / TO-33

Resistive opto-isolator VTL2C1 in a TO-33 package

The TO-12 and TO-33 packages have 4 leads.[8] TO-33 has 38.1 mm (1.50 in) leads[9] like TO-5 while TO-12 has 12.7 mm (0.50 in) leads. For transistors, the fourth wire is typically connected to the metal case as a means of electromagnetic shielding for radio frequency applications.

TO-75

The TO-75 package has 6 leads (at most one of those may be omitted).[10] The minimum angle between two adjacent leads is 60°.

TO-76 / TO-77

Voltage regulator integrated circuit (Tesla MAA723) in a TO-76 package.

The TO-76 and TO-77 packages have 8 leads (up to three of those may be omitted).[11] The minimum angle between two adjacent leads is 45°. The TO-77 package differs from the TO-76 package only in that the bottom of a TO-77 package can sit directly on a circuit board whereas the TO-76 package requires a distance of up to 1.02 mm (0.040 in) between circuit board and package.[12]

TO-78 / TO-79 / TO-80 / TO-99

Sample-and-hold integrated circuit (Tesla MAC198) in a reduced-height TO-99 package.

The TO-78,[13] TO-79,[14] TO-80,[15] and TO-99[16] packages have 8 leads (up to three of those may be omitted). The minimum angle between two adjacent leads is 45°. These packages differ from other variants in the height of the cap. Instead of 6.3 mm (0.25 in) the cap height is only 4.45 mm (0.175 in) for TO-78 / TO-99, 3.81 mm (0.150 in) for TO-79, and 2.41 mm (0.095 in) for TO-80. The TO-78 package differs from the TO-99 package only in that the bottom of a TO-78 package can sit directly on a circuit board whereas the TO-99 package requires a distance of up to 1.02 mm (0.040 in) between circuit board and package.

TO-74

The TO-74 package has 10 leads (at most one of those may be omitted).[17] The minimum angle between two adjacent leads is 36°.

TO-96 / TO-97 / TO-100

The TO-96,[18] TO-97,[19] and TO-100[20] packages have 10 leads (at most one of those may be omitted). The minimum angle between two adjacent leads is 36°. For these packages the diameter of the circle of leads is increased from 5.08 mm (0.200 in) to 5.84 mm (0.230 in). This allows a slightly increased chip area in a cap of unchanged diameter. TO-96 has the standard cap height of 6.3 mm (0.25 in), while TO-100 and TO-97 have reduced cap heights of 4.45 mm (0.175 in) (like TO-78) and 3.81 mm (0.150 in) (like TO-79), respectively.

TO-73

The TO-73 package has 12 leads (at most one of those may be omitted).[21] The minimum angle between two adjacent leads is 30°.

TO-101

The TO-101 package has 12 leads (at most one of those may be omitted).[22] The minimum angle between two adjacent leads is 30°. For this package the diameter of the circle of leads is increased from 5.08 mm (0.200 in) to 5.84 mm (0.230 in). This allows a slightly increased chip area in a cap of unchanged diameter. TO-101 has a reduced cap height of 4.45 mm (0.175 in) (like TO-78).

TO-205

Voltage reference integrated circuit (National Semiconductor LH0070) in a TO-205-AF package

TO-205 is intended to replace previous definitions of packages with leads arranged in a circle with a diameter of 5.08 mm (0.200 in).[23][24] The different outlines are now defined as variants of TO-205: TO-5 is renamed to TO-205-AA, TO-12 to TO-205-AB, TO-33 to TO-205-AC, TO-39 to TO-205-AD. A new package with 3 leads and a cap height of 4.32 mm (0.170 in) (similar to TO-78 / TO-99) is added as TO-205-AF.

National Standards

Standards organization Standard Designation for
TO-5 TO-12 TO-33 TO-39 TO-77
JEDEC JEP95[24] TO-205-AA TO-205-AB TO-205-AC TO-205-AD
IEC IEC 60191[a][25] C4/B4A C4/B6C C4/B6A C4/B4C C4/B7C
DIN DIN 41873[26][25] 5A3 5C4 5C3 5C8
EIAJ / JEITA ED-7500A[a][27] TC5/TB-5A TC5/TB-14C TC5/TB-14A TC5/TB-5C TC5/TB-15C
British Standards BS 3934[a][28][25] SO-3/SB3-3A SO-3/SB4-1B SO-3/SB3-3B SO-3/SB8-1B
Gosstandart GOST 18472—88[29] KT-2-12[b] KT-2-7[c]
Rosstandart GOST R 57439[30]
Kombinat Mikroelektronik Erfurt TGL 11811[31] B3/15-3a
TGL 26713/07[31] F1BC3
  1. ^ a b c These standards have separate drawings for the package case and the base.
  2. ^ Russian: КТ-2-12
  3. ^ Russian: КТ-2-7

References

  1. ^ a b "JEDEC TO-5 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
  2. ^ a b "Fairchild 2N697". Transistor Museum. Retrieved 2021-07-16.
  3. ^ "Metal Can Packages" (PDF). National Semiconductor / Texas Instruments. August 1999. pp. 7–14. Retrieved 2021-06-21.
  4. ^ "1965: Package is the first to accommodate system design considerations". Computer History Museum. Retrieved 2021-06-21.
  5. ^ "TO-39" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  6. ^ "TO-9" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  7. ^ "...does not meet the minimum criteria ...for registration." "TO-42" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  8. ^ "TO-12" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  9. ^ "TO-33" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-04. Retrieved 2021-06-21.
  10. ^ "TO-75" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  11. ^ "TO-76" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-04. Retrieved 2021-06-21.
  12. ^ "TO-77" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  13. ^ "TO-78" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  14. ^ "TO-79" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  15. ^ "TO-80" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  16. ^ "TO-99" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  17. ^ "TO-74" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  18. ^ "TO-96" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  19. ^ "TO-97" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-05. Retrieved 2021-06-21.
  20. ^ "TO-100" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  21. ^ "TO-73" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  22. ^ "TO-101" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  23. ^ "Index by Device Type of Registered Transistor Outlines (TO)". JEDEC Publication No. 95 (PDF). JEDEC. October 2010. Retrieved 2021-07-13.
  24. ^ a b "Header Family 0.200 Pin Circle". JEDEC Publication No. 95 (PDF). JEDEC. November 1982. pp. 178–181. Retrieved 2021-07-13.
  25. ^ a b c "Semiconductors" (PDF). Pro Electron. 1978. pp. 215–219. Retrieved 2021-06-17.
  26. ^ "Semiconductor Databook" (PDF). Heilbronn: AEG-Telefunken. p. 15. Retrieved 2021-08-20.
  27. ^ "EIAJ ED-7500A Standards for the Dimensions of Semiconductor Devices" (PDF). JEITA. 1996. Retrieved 2021-06-14.
  28. ^ "Semiconductor and Photoelectric Devices" (PDF). Mullard. 1968. p. 457. Retrieved 2021-06-14.
  29. ^ "ГОСТ 18472—88 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры" [GOST 18472—88 Semiconductor devices - basic dimensions] (PDF) (in Russian). Rosstandart. 1988. pp. 37–38. Retrieved 2021-06-17.
  30. ^ "ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры" [Semiconductor devices - basic dimensions] (PDF) (in Russian). Rosstandart. 2017. p. 45. Retrieved 2021-06-17.
  31. ^ a b "TGL 26713/07: Gehäuse für Halbleiterbauelemente - Bauform F" (PDF) (in German). Leipzig: Verlag für Standardisierung. June 1988. Retrieved 2021-06-15.

External links

  • TO-5 package from EESemi.com
  • v
  • t
  • e
Single diode
  • DO-201 (DO-27)
  • DO-204 (DO-7 / DO-26 / DO-35 / DO-41)
  • DO-213 (MELF / SOD-80 / LL34)
  • DO-214 (SMA / SMB / SMC)
  • SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin
  • SOT / TSOT
  • TO-3 (TH / Panel)
  • TO-5 (TH)
  • TO-8 (TH)
  • TO-18 (TH)
  • TO-39 (TH)
  • TO-66 (TH / Panel)
  • TO-92 (TH)
  • TO-126 (TH / Panel)
  • TO-202 (TH / Panel)
  • TO-220 (TH / Panel)
  • TO-247 (TH / Panel)
  • TO-251 (IPAK) (SMT)
  • TO-252 (DPAK) (SMT)
  • TO-262 (I2PAK) (SMT)
  • TO-263 (D2PAK) (SMT)
  • TO-268 (D3PAK) (SMT)
  • TO-273 (Super-220) (SMT)
  • TO-274 (Super-247) (SMT)
Single rowDual rowQuad row
Grid arrayWaferRelated topics
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.